--- 格式版本: 2 标题: "Marelli and Microchip develop open display connectivity solution" 原文链接: "https://www.engineering.com/marelli-and-microchip-develop-open-display-connectivity-solution/" 发布日期: "2026-09-04" 发布时间校准状态: "found" 发布时间需复核: "否" 发布时间来源: "llm:local:strict_original_body" 发布时间证据: "Sep 4, 2026" 发布时间校准原因: "标题附近明确标注发布时间为 Sep 4, 2026，符合候选优先级；September 3 为正文事件日期，排除。" 发布时间校准置信度: "1" 发布时间候选数量: 13 发布时间严格候选数量: 3 发布时间原页读取状态: "source template page reused from URL open" 发布时间未找到原因: "" 发布时间校准时间: "2026-09-04T20:40:13+08:00" 发布时间仲裁状态: "confirmed" 发布时间仲裁尝试次数: 1 发布时间仲裁耗时毫秒: 25637 发现时间: "2026-09-04T20:38:32+08:00" 入库时间: "2026-09-04T12:40:38.945Z" 来源平台: "Engineering.com 搜索" 搜索渠道: "source_template" 搜索词: "https://www.engineering.com/?s=AI%20Rack" 匹配关键词: - "AI Rack" - "AI" - "delivery" - "performance" 相关厂家: - "NVIDIA" 相关专家: [] 内容类型: "网页" 抓取工具: "Jina Reader" 清洗工具: "Jina Reader Markdown + Defuddle/Readability 正文提取" 原始附件: [] AI优质: "否" AI打分: 35 AI分档: "非优质" AI质检状态: "不通过" AI打分理由: "正文主线为汽车座舱显示连接方案（Marelli与Microchip的ASA Motion Link），属于车载SerDes/显示互连，非超节点/AI Rack/机架级AI基础设施，主题不相关。来源为一般工程媒体，2026年9月发布，含少量技术参数（16Gbps、TDD、FEC）和合作演示，但无数据中心机架级系统、AI训练/推理平台或商业部署信号。无历史知识库命中，但本质是汽车电子领域，不满足高价值准入通道，且命中强否决中‘超节点只占少量篇幅/主体是终端应用’的情形。" AI质检模型: "zj-deepseek-v4-flash" AI质检时间: "2026-09-04T20:40:58+08:00" AI主题相关性: 2 AI来源权威性: 10 AI新颖性: 8 AI技术细节: 5 AI商业部署信号: 2 AI完整性: 8 AI评分提示词版本: "v17-精简生产版" AI评分提示词SHA256: "48fb9777f386026761b4873eaff30807694fb11e9b352d7c69bf2dfde750cc7d" AI评分知识库版本: "knowledge_base_v1-20260819+runtime.89" AI评分知识库SHA256: "ff54e1479f3e5fb41037cb816bc8f6bdc83e7bcfa466d5fcf32f781220de91c7" AI评分知识库检索词: "[\"AI Rack\",\"https://www.engineering.com/?s=AI%20Rack\",\"RAS\",\"NVIDIA\",\"Intel\",\"URL\",\"IT\",\"BIM\",\"PLM/ERP\",\"EDA\",\"www.engineering.com/games/temple-run-2\",\"www.engineering.com/games/2048\"]" AI评分知识库命中: "[{\"id\":\"july-correct-0105\",\"title\":\"Microsoft expands Azure AI and HPC infrastructure with AMD - The Official Microsoft Blog\",\"sourceType\":\"labeled_article\",\"time\":\"2026-07\",\"matchedTerms\":[\"RAS\",\"URL\",\"IT\",\"EDA\"],\"rank\":-9.386484674775874},{\"id\":\"july-correct-0081\",\"title\":\"AAI 2026: 6th Gen AMD EPYC Server CPUs Power the Agentic Data Center\",\"sourceType\":\"labeled_article\",\"time\":\"2026-07\",\"matchedTerms\":[\"RAS\",\"NVIDIA\",\"Intel\",\"URL\",\"IT\",\"EDA\"],\"rank\":-8.560383022518598},{\"id\":\"july-correct-0012\",\"title\":\"Microsoft to deploy AMD Helios rackscale solution to support inference workloads and Azure services\",\"sourceType\":\"labeled_article\",\"time\":\"2026-07\",\"matchedTerms\":[\"AI Rack\",\"RAS\",\"URL\",\"IT\",\"EDA\"],\"rank\":-8.44032755881547},{\"id\":\"july-correct-0062\",\"title\":\"Why AI Racks Need an Open Signal Conditioning Standard\",\"sourceType\":\"labeled_article\",\"time\":\"2026-07\",\"matchedTerms\":[\"AI Rack\",\"RAS\",\"NVIDIA\",\"URL\",\"IT\",\"EDA\"],\"rank\":-8.425921807407997},{\"id\":\"july-correct-0026\",\"title\":\"The Rackscale AI System Roadmaps That AMD Is Using To Chase Money\",\"sourceType\":\"labeled_article\",\"time\":\"2026-07\",\"matchedTerms\":[\"RAS\",\"NVIDIA\",\"Intel\",\"URL\",\"IT\",\"EDA\"],\"rank\":-7.65533260760489}]" 采集批次: "2026年9月4日19点09分47秒" 采集批次ID: "20260904-190947-e38cdb0b" 去重键: "https://www.engineering.com/marelli-and-microchip-develop-open-display-connectivity-solution" --- Title: Marelli and Microchip develop open display connectivity solution URL Source: https://www.engineering.com/marelli-and-microchip-develop-open-display-connectivity-solution/ Published Time: 2026-09-04T11:24:18+00:00 Markdown Content: # [![Image 1: Engineering.com logo](https://www.engineering.com/wp-content/uploads/2024/03/engineering-com-logo-1.svg)](https://www.engineering.com/) Continue to Site [Skip to 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Marelli and Microchip Technology announced a new solution that enables graphics and video content generated by a vehicle’s central computer to be streamed directly to automotive displays using ASA Motion Link (ASA-ML), an open standard for automotive video connectivity. The demonstrator of this solution helps vehicle makers simplify display architectures, optimize system costs and increase sourcing flexibility while supporting the transition toward software-defined vehicles (SDVs). ![Image 47](https://www.engineering.com/wp-content/uploads/2026/09/Marelli_Microchip-1.jpg) Marelli and Microchip Technology announced a new open-standard display connectivity solution for software-defined vehicles. ASA Motion Link is an open standard for automotive video connectivity and SerDes (serializer-deserializer) communication, defined by the Automotive SerDes Alliance (ASA), a global consortium of vehicle makers, Tier 1 suppliers and semiconductor companies. By enabling secure, high-speed video and graphics transmission across products from multiple technology providers, the standard supports greater compatibility across the automotive ecosystem and provides a scalable alternative to proprietary video transmission technologies. As a founding member of ASA, Microchip is advancing the automotive industry’s transition from proprietary connectivity technologies to open, interoperable standards, and has demonstrated broad interoperability with its camera solutions and is now extending those solutions to enable display connectivity. As vehicle architectures evolve toward centralized computing and software-defined vehicles (SDVs), vehicle makers are looking for connectivity solutions that can support growing performance demands while reducing complexity, controlling costs and enabling scalable vehicle electronics architectures. In the joint demonstrator solution, graphics and video content generated by the vehicle’s central computer is processed and transmitted through Microchip’s VS7000 ASA-ML chipset over a high-speed standardized link. Marelli pioneers the display-side integration of the technology by enabling the configuration and optimization of the ASA ML deserializer to decode standardized video streams directly at the display. This ensures accurate reception, synchronization and delivery of centrally generated content, including camera feeds, navigation maps, infotainment graphics and vehicle control interfaces, while enabling simplified display-side electronic architectures. ### **Technology highlights** * **Open interoperability**enabling seamless connectivity between cockpit systems and displays from multiple technology providers. * **Greater supplier flexibility**thanks to open protocol specifications supported across the automotive ecosystem. * **Integrated security**with link-layer authentication and encryption embedded in the communication channel. * **Robust data transmission**with lossless communication and high immunity to electromagnetic noise. * **Scalable performance**supporting data rates up to 16 Gbps to address a range of display requirements. * **Optimized efficiency**enabled by embedded Time Division Duplex (TDD) functionality and simplified Forward Error Correction (FEC), contributing to lower power consumption. * **Path**to increasingly Ethernet-centric vehicle architectures The collaboration demonstrates how open-standard connectivity supports in-vehicle networking and electronics by enabling secure communication between centralized computing systems and displays. It also reflects Marelli’s broader commitment to adopting open standards that help simplify development, optimize system costs, and promote a more open automotive ecosystem. For more information, visit [microchip.com](https://www.microchip.com/). 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