---
格式版本: 2
标题: "Scaling Inference Prefill with High-Radix Photonic Interconnects"
原文链接: "https://arxiv.org/abs/2609.01821"
发布日期: "2026-09-01"
发布时间校准状态: "found"
发布时间需复核: "否"
发布时间来源: "rule:local:strict_original_body"
发布时间证据: "**\\[v1\\]** Tue, 1 Sep 2026 19:54:04 UTC (3,724 KB)"
发布时间校准原因: "规则确认唯一严格发布时间，来源 local:strict_original_body"
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发布时间未找到原因: ""
发布时间校准时间: "2026-09-04T01:35:46+08:00"
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发布时间仲裁尝试次数: 0
发布时间仲裁耗时毫秒: 0
发现时间: "2026-09-04T01:32:14+08:00"
入库时间: "2026-09-03T17:35:46.316Z"
来源平台: "arXiv 学术论文搜索"
搜索渠道: "source_template"
搜索词: "https://arxiv.org/search/?query=GPU&searchtype=all"
匹配关键词:
  - "GPU"
  - "Scale-up"
  - "latency"
  - "bandwidth"
  - "throughput"
  - "AI"
相关厂家:
  []
相关专家:
  []
内容类型: "网页"
抓取工具: "Free Fetch + Defuddle"
清洗工具: "Defuddle Markdown + Defuddle/Readability 正文提取"
原始附件:
  []
AI优质: "是"
AI打分: 84
AI分档: "高置信优质"
AI质检状态: "通过"
AI打分理由: "论文直接研究光子互连在GPU scale-up中的应用，属于AI Rack高速互连核心方向，包含具体模型模拟、延迟提升倍数等详细数据，2026年新颖性强，来源为arXiv学术论文，无直接商业信号。"
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AI质检时间: "2026-09-04T01:37:29+08:00"
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AI新颖性: 19
AI技术细节: 19
AI商业部署信号: 5
AI完整性: 9
AI摘要: "该论文通过模拟短、中、长上下文MoE模型，量化了3D集成光子互连对LLM推理prefill的收益，显示相比铜基系统在高压批处理下延迟改进2.1—3.2倍，在通信受限配置下改进2.8—5.8倍。"
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AI摘要时间: "2026-09-04T00:18:16.925Z"
采集批次: "2026年9月3日22点43分34秒"
采集批次ID: "20260903-224334-406"
去重键: "https://arxiv.org/abs/2609.01821"
---

## Computer Science > Distributed, Parallel, and Cluster Computing

## Title:Scaling Inference Prefill with High-Radix Photonic Interconnects

[View PDF](https://arxiv.org/pdf/2609.01821) [HTML (experimental)](https://arxiv.org/html/2609.01821v1)

> Abstract:With the rise of inference as today's dominant AI workload, the industry is transitioning to high-bandwidth photonic interconnects to meet the large scale-up requirements of increasingly complex Mixture-of-Experts (MoE) models. This paper quantifies the benefits of 3D-integrated photonic interconnects for inference prefill by analyzing tradeoffs between high-concurrency throughput for Large Language Model (LLM) chat and the large context windows typically required for reasoning and agentic AI. We simulate three MoE models: short context (1K--8K tokens), medium context (128K tokens), and long context (1M tokens). We evaluate this workload across existing copper-based GPU systems and one with high bandwidth integrated photonics. We show 2.1--3.2x latency improvements in the stressed high-batch regimes and 2.8--5.8x improvements over baselines in communication-limited configurations. 3D photonics enable the 1152-GPU footprint required to lower time-to-first-token, yielding 2.2--4.5x speedups across production-grade platforms when electrical systems cross their inherent scale-up-pod limits.

| Subjects: | Distributed, Parallel, and Cluster Computing (cs.DC); Hardware Architecture (cs.AR) |
| --- | --- |
| Cite as: | [arXiv:2609.01821](https://arxiv.org/abs/2609.01821) \[cs.DC\] |
|  | (or [arXiv:2609.01821v1](https://arxiv.org/abs/2609.01821v1) \[cs.DC\] for this version) |
|  | [https://doi.org/10.48550/arXiv.2609.01821](https://doi.org/10.48550/arXiv.2609.01821) |
| Related DOI: | [https://doi.org/10.1109/HotI70696.2026.00020](https://doi.org/10.1109/HotI70696.2026.00020) |

## Submission history

From: Arulselvan Madhavan \[[view email](https://arxiv.org/show-email/49ee4b1e/2609.01821)\]  
**\[v1\]** Tue, 1 Sep 2026 19:54:04 UTC (3,724 KB)

[Which authors of this paper are endorsers?](https://arxiv.org/auth/show-endorsers/2609.01821) | Disable MathJax ([What is MathJax?](https://info.arxiv.org/help/mathjax.html))