---
格式版本: 2
标题: "IBM Bakes AI Into Power10 Chips"
原文链接: "https://www.sdxcentral.com/news/ibm-bakes-ai-into-power10-chips/"
发布日期: "2026-08-31"
发布时间校准状态: "found"
发布时间需复核: "否"
发布时间来源: "llm:local:strict_original_body"
发布时间证据: "Published Time: Mon, 31 Aug 2026 09:44:09 GMT"
发布时间校准原因: "正文中明确标注的发布时间，优先于其他日期候选。"
发布时间校准置信度: "1"
发布时间候选数量: 32
发布时间严格候选数量: 10
发布时间原页读取状态: "source template page reused from URL open"
发布时间未找到原因: ""
发布时间校准时间: "2026-08-31T23:58:43+08:00"
发布时间仲裁状态: "confirmed"
发布时间仲裁尝试次数: 3
发布时间仲裁耗时毫秒: 28865
发现时间: "2026-08-31T23:57:11+08:00"
入库时间: "2026-08-31T15:59:21.285Z"
来源平台: "SDxCentral 搜索"
搜索渠道: "source_template"
搜索词: "site:sdxcentral.com Hot Chips"
匹配关键词:
  - "AI"
  - "delivery"
  - "performance"
  - "latency"
  - "bandwidth"
相关厂家:
  - "AMD"
  - "Meta"
相关专家:
  []
内容类型: "网页"
抓取工具: "Jina Reader"
清洗工具: "Jina Reader Markdown + Defuddle/Readability 正文提取"
原始附件:
  []
图片摘要:
  - "✗ ./assets/img-ca27c130.png | decorative | 网站信任徽章，与正文无关"
  - "✗ ./assets/img-bca435ad.webp | screenshot | 截图内容无法确认与Power10芯片相关"
  - "✗ ./assets/img-e408dc8f.webp | decorative | AI概念装饰图，与正文主题无关"
AI摘要: "IBM在Hot Chips 2020上发布Power10处理器，将AI推理能力直接集成进芯片，计划2021年中上市。相较Power9，Power10每个核心性能提升约30%，AI推理性能提升20倍，并支持跨服务器低延迟共享内存。"
AI摘要模型: "ali-deepseek-v4-flash"
AI摘要时间: "2026-08-31T23:37:06.727Z"
AI优质: "否"
AI打分: 51
AI分档: "非优质"
AI质检状态: "不通过"
AI打分理由: "正文主线是2020年发布的IBM Power10通用服务器处理器及片上AI推理，并非机架级AI系统；仅多服务器低时延共享内存与超节点基础设施有一定关联。SDxCentral为专业媒体且含IBM工程师直接采访，正文完整。固定知识库未命中Power10，但不能据此认定首次出现；本文实际发布日期为2020年，新增仅限当年的15/30核、PowerAXON/OMI、每插槽4TB DDR4与400GB/s、20倍推理性能及计划2021年上市等旧规格，无当前客户、量产或部署增量。命中旧架构且主线弱相关的否决项。"
AI质检模型: "gpt-5.6-sol"
AI质检时间: "2026-09-01T07:41:36+08:00"
AI主题相关性: 7
AI来源权威性: 12
AI新颖性: 3
AI技术细节: 15
AI商业部署信号: 4
AI完整性: 10
AI评分提示词版本: "v17-精简生产版"
AI评分提示词SHA256: "48fb9777f386026761b4873eaff30807694fb11e9b352d7c69bf2dfde750cc7d"
AI评分知识库版本: "knowledge_base_v1-20260819+runtime.63"
AI评分知识库SHA256: "b2a4248d43868dee4c86d2b502d43668e260aea6b69d15f73a5dfe53287ca63f"
AI评分知识库检索词: "[\"Hot Chips\",\"site:sdxcentral.com Hot Chips\",\"RAS\",\"DPU\",\"GPU\",\"Meta\",\"AMD\",\"Intel\",\"IBM\",\"Power10\",\"URL\",\"GMT\"]"
AI评分知识库命中: "[{\"id\":\"july-correct-0001\",\"title\":\"全球首颗2nm GPU来了！苏姿丰甩出“最强AI机架”，CPU性能干翻英伟达 - 智东西\",\"sourceType\":\"labeled_article\",\"time\":\"2026-07\",\"matchedTerms\":[\"RAS\",\"DPU\",\"GPU\",\"Meta\",\"AMD\"],\"rank\":-11.946729831829678},{\"id\":\"runtime-f25234b5fb900c12eebcf43a\",\"title\":\"Scale-in? Nvidia’s ‘fifth’ pillar of AI networking rests on shaky ground\",\"sourceType\":\"ai_excellent_article\",\"time\":\"\",\"matchedTerms\":[\"Hot Chips\",\"RAS\",\"DPU\",\"GPU\",\"URL\",\"GMT\"],\"rank\":-11.104793304319372},{\"id\":\"july-correct-0081\",\"title\":\"AAI 2026: 6th Gen AMD EPYC Server CPUs Power the Agentic Data Center\",\"sourceType\":\"labeled_article\",\"time\":\"2026-07\",\"matchedTerms\":[\"RAS\",\"GPU\",\"AMD\",\"Intel\",\"URL\"],\"rank\":-10.329586915894634},{\"id\":\"july-correct-0034\",\"title\":\"AMD Fires Back at Nvidia with Helios AI System, Epyc CPUs\",\"sourceType\":\"labeled_article\",\"time\":\"2026-07\",\"matchedTerms\":[\"RAS\",\"DPU\",\"GPU\",\"Meta\",\"AMD\",\"Intel\",\"URL\"],\"rank\":-10.030029923279379},{\"id\":\"july-correct-0075\",\"title\":\"From EPYC to Helios, AMD and Meta are Scaling the Future of AI Together\",\"sourceType\":\"labeled_article\",\"time\":\"2026-07\",\"matchedTerms\":[\"RAS\",\"GPU\",\"Meta\",\"AMD\",\"URL\"],\"rank\":-9.63671447691496}]"
采集批次: "2026年8月31日23点05分08秒"
采集批次ID: "20260831-230508-125"
去重键: "https://www.sdxcentral.com/news/ibm-bakes-ai-into-power10-chips"
---

Title: IBM Bakes AI Into Power10 Chips

URL Source: https://www.sdxcentral.com/news/ibm-bakes-ai-into-power10-chips/

Published Time: Mon, 31 Aug 2026 09:44:09 GMT

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# IBM Bakes AI Into Power10 Chips

 The new chips boast 30% higher performance per core and support for low latency shared memory across multiple servers. 

August 17, 2020 By[Tobias Mann](https://www.sdxcentral.com/profile/tobias-mann/)[Have your say](https://www.sdxcentral.com/news/ibm-bakes-ai-into-power10-chips/#comments)

[](https://www.sdxcentral.com/news/ibm-bakes-ai-into-power10-chips/)[](https://www.sdxcentral.com/news/ibm-bakes-ai-into-power10-chips/)[](https://www.sdxcentral.com/news/ibm-bakes-ai-into-power10-chips/)[](https://www.sdxcentral.com/news/ibm-bakes-ai-into-power10-chips/)[](https://www.sdxcentral.com/news/ibm-bakes-ai-into-power10-chips/)[](https://www.addtoany.com/share)

[IBM](https://www.sdxcentral.com/directory/ibm/ "IBM") is going all in on [artificial intelligence (AI)](https://www.sdxcentral.com/artificial-intelligence/definitions/what-is-artificial-intelligence/ "What is artificial intelligence (AI)? Its applications, architecture and future") infused [hybrid-cloud](https://www.sdxcentral.com/cloud/definitions/what-is-hybrid-cloud/ "What Is the Hybrid Cloud?") deployments with its latest generation of Power-series chips based on Samsung's 7-nanometer manufacturing process. The company took the lid off its new chips today at Hot Chips 2020.

IBM's Power10 chips, which will hit the market in mid-2021, not only offers higher performance and data bandwidths than its predecessor, they do so while sipping a third of the power, claims Bill Starke, distinguished engineer for IBM Power. "We've rebuilt our processor architecture from the ground up for energy efficiency in this generation, and we're going to get a pretty massive three-X energy efficiency improvement over our prior Power9 infrastructure," he said in an interview with SDxCentral.

While IBM's chips seldom get the fanfare enjoyed by rivals [Intel](https://www.sdxcentral.com/directory/intel/ "Intel") and AMD, the Power series hits a different subset of the [enterprise](https://www.sdxcentral.com/resources/glossary/enterprise/ "Enterprise") and hybrid [cloud](https://www.sdxcentral.com/cloud/definitions/what-is-cloud/ "What is the cloud? Technology, advantages and disadvantages") market that demand high [bandwidth](https://www.sdxcentral.com/resources/glossary/bandwidth/ "Bandwidth") for processing financial transactions or AI inference.

"We've really historically always been highly differentiated in our ability to bring data bandwidth into our systems," Starke said. "We are in big-iron enterprise servers, the kind of stuff that's behind the scenes — worldwide banking, logistics."

 Containing the Power 
According to Brian Thompto, distinguished engineer for IBM Power, each core offers roughly 30% higher performance than the previous generation of Power processors.

Power10 is a big chip with 15 cores spread across a 600 square-millimeter die, and that's for the single-chip version. IBM also offers a dual-chip module pushing the combined core count to 30.

"The single-chip module is focused on maximizing the core strength. You're feeding the most amount of energy per core... and also maximizing the bandwidth," Starke said.

Meanwhile, the dual-chip module aims to deliver the highest compute density possible at the sacrifice of bandwidth.

By putting two chips on a single socket, IBM is also able to lower the overall thermal design power. "We are actually able to profitably feed 1200 square millimeters of silicon," Starke said.

While 15 or even 30 cores may not sound like much compared to the 28-core and 64-core offerings from Intel and AMD, Starke claims the Power10's cores are more than comparable.

"If you're comparing this to typical x86, think of one of our cores as being aimed at doing roughly two times the work of one of their cores," he said.

 Composable Infrastructure Without Compromise 
Thanks to improvements to IBM's PowerAXON and OMI Memory signaling interfaces, Power10 now supports shared memory across multiple servers.

While the idea of [composable infrastructure](https://www.sdxcentral.com/data-center/composable/definitions/what-is-composable-infrastructure-definition/ "What is Composable Infrastructure? Definition") is nothing new, "we're building that capability into Power10 in a manner where you can do it with reasonable latency," claimed Starke, adding that the problem with existing shared memory schemes is that while it's possible to share memory, it can't be done at acceptable latencies.

"From a cloud economics standpoint, this is all about not having to configure so much memory on each [server](https://www.sdxcentral.com/resources/glossary/server/ "Server") to meet spike demand because I can always borrow from my neighbor," he said. "On the other hand, I could have the option of offering capabilities that are far beyond what any single server can do."

For example, a [cloud provider](https://www.sdxcentral.com/cloud/definitions/what-is-cloud/what-are-cloud-service-providers/ "What Are Cloud Service Providers?") using IBM's Power10 could in theory offer up to 200 terabytes of memory for memory-intensive workloads because the memory can be shared across multiple servers.

And in theory, a cloud provider could offer up to 2 petabytes of memory, Starke said.

On the topic of memory, each socket can be outfitted with up to 4 terabytes of DDR4 memory for 400 GB/s of bandwidth. Customers that need higher bandwidth and are willing to sacrifice capacity can double that by swapping in GDDR memory dims.

Finally, the chip can support large pools of persistent memory for less bandwidth-intensive workloads.

 AI Inference Baked In 
With Power10, IBM has also stepped up its AI processing capabilities by baking AI inferencing capabilities — traditionally handled by banks of GPUs — right into the chip. AI is nothing new to IBM or its Power line up, however, the company's Power9 chips were largely focused on AI training rather than inference.

IBM claims these new capabilities enable the new chip to achieve AI inference performance 20 times greater than its predecessor.

IBM envisions a hybrid-cloud environment, where rather than having to offload data to the cloud for AI training or inference, it can be processed locally.

"Now we're putting the amount of number crunching into the general-purpose processor core so that we don't have to be offloading it to other places," Starke said. "It runs right at the heart of our systems."

[](https://www.sdxcentral.com/news/ibm-bakes-ai-into-power10-chips/)[](https://www.sdxcentral.com/news/ibm-bakes-ai-into-power10-chips/)[](https://www.sdxcentral.com/news/ibm-bakes-ai-into-power10-chips/)[](https://www.sdxcentral.com/news/ibm-bakes-ai-into-power10-chips/)[](https://www.sdxcentral.com/news/ibm-bakes-ai-into-power10-chips/)[](https://www.addtoany.com/share)

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