---
格式版本: 2
标题: "Research|Optics & Power: OCP APAC Summit Takeaways"
原文链接: "https://fundaai.substack.com/p/researchoptics-and-power-ocp-apac"
发布日期: "2026-08-17"
发布时间校准状态: "found"
发布时间需复核: "否"
发布时间来源: "rule:scrape:strict_html_body"
发布时间证据: "div class=pencraft pc-display-flex pc-gap-12 pc-alignItems-center pc-reset byline-wrapper: Aug 17, 2026"
发布时间校准原因: "规则确认唯一严格发布时间，来源 scrape:strict_html_body"
发布时间校准置信度: "high"
发布时间候选数量: 11
发布时间严格候选数量: 2
发布时间原页读取状态: "source template page reused from URL open"
发布时间未找到原因: ""
发布时间校准时间: "2026-08-31T11:55:51+08:00"
发布时间仲裁状态: "skipped"
发布时间仲裁尝试次数: 0
发布时间仲裁耗时毫秒: 0
发现时间: "2026-08-31T11:48:52+08:00"
入库时间: "2026-08-31T03:55:51.548Z"
来源平台: "Substack 数据中心相关博客搜索"
搜索渠道: "source_template"
搜索词: "site:substack.com powershelf"
匹配关键词:
  - "CPO"
  - "Scale-up"
  - "delivery"
相关厂家:
  - "NVIDIA"
  - "Broadcom"
相关专家:
  []
内容类型: "网页"
抓取工具: "Free Fetch + Defuddle"
清洗工具: "Defuddle Markdown + Defuddle/Readability 正文提取"
原始附件:
  []
AI优质: "否"
AI打分: 48
AI分档: "非优质"
AI质检状态: "不通过"
AI打分理由: "正文主线是跨机架scale-up网络、CPO及兆瓦级机架的800VDC供电演进，主题较强；但来源仅为参会者Substack总结，未提供官方文件、采访或可追溯证据。相较历史知识库，800VDC、固态变压器及OCP协作已被更完整披露；本文仅新增NVIDIA、Broadcom自称CPO已投产而ASE认为生态未就绪的观点冲突，缺少产品、数量、客户和时间表验证。技术内容停留在方向性概述，且正文在“下文展开”前结束，明显不完整。命中会议综述无充分新标准、实测或部署的否决项。"
AI质检模型: "gpt-5.6-sol"
AI质检时间: "2026-08-31T11:56:02+08:00"
AI主题相关性: 17
AI来源权威性: 6
AI新颖性: 7
AI技术细节: 11
AI商业部署信号: 3
AI完整性: 4
AI评分提示词版本: "v17-精简生产版"
AI评分提示词SHA256: "48fb9777f386026761b4873eaff30807694fb11e9b352d7c69bf2dfde750cc7d"
AI评分知识库版本: "knowledge_base_v1-20260819+runtime.62"
AI评分知识库SHA256: "b53abf2242d71cbdd0daf92240736320626be4a6f0e164c2fafe18c1a554a4a3"
AI评分知识库检索词: "[\"powershelf\",\"site:substack.com powershelf\",\"CPO\",\"800V\",\"NVIDIA\",\"Broadcom\",\"OCP\",\"APAC\",\"OFC\",\"EMEA\",\"ASE\",\"OSATs\"]"
AI评分知识库命中: "[{\"id\":\"historical-jan-apr-05\",\"title\":\"五、AI 光通信需求、可插拔光模块与光互连接口演进\",\"sourceType\":\"curated_item\",\"time\":\"2026-01_to_2026-04\",\"matchedTerms\":[\"CPO\",\"NVIDIA\",\"Broadcom\",\"OCP\",\"OFC\"],\"rank\":-21.024512106381227},{\"id\":\"runtime-4246c72b086f0cc943f99653\",\"title\":\"Tech Titans Outline Their Vision for 800 VDC\",\"sourceType\":\"ai_excellent_article\",\"time\":\"\",\"matchedTerms\":[\"NVIDIA\",\"OCP\",\"APAC\",\"ASE\"],\"rank\":-11.08292282072126},{\"id\":\"runtime-5581f72bc66fda8e6c6bf711\",\"title\":\"Advancing Standards-Based AI Fabric RAS Through COSMOS Integration\",\"sourceType\":\"ai_excellent_article\",\"time\":\"2026-08-10\",\"matchedTerms\":[\"OCP\",\"APAC\",\"ASE\"],\"rank\":-8.986318049097896},{\"id\":\"runtime-e04eba4cb287330134ac9145\",\"title\":\"Nvidia revenue doubles over last year, as company forecasts record growth\",\"sourceType\":\"ai_excellent_article\",\"time\":\"\",\"matchedTerms\":[\"NVIDIA\",\"APAC\",\"ASE\"],\"rank\":-8.843781763730437},{\"id\":\"july-correct-0015\",\"title\":\"AMD to join the optical interconnect party with 2027 Instinct GPUs\",\"sourceType\":\"labeled_article\",\"time\":\"2026-07\",\"matchedTerms\":[\"CPO\",\"NVIDIA\",\"Broadcom\",\"ASE\"],\"rank\":-8.77514684726727}]"
AI摘要: "OCP APAC峰会在台北举行，核心信号是：scale-up网络短期用铜、长期转向光；CPO方面英伟达和博通称已量产，但ASE认为生态未成熟。"
AI摘要模型: "ali-deepseek-v4-flash"
AI摘要时间: "2026-08-31T23:37:20.439Z"
采集批次: "2026年8月31日11点48分36秒"
采集批次ID: "20260831-114836-897"
去重键: "https://fundaai.substack.com/p/researchoptics-and-power-ocp-apac"
---

We attended the OCP APAC Summit in Taipei this week. This note outlines our top-level takeaways on optics and power.

A clear theme at the conference was scale-up networking, and whether it stays on copper or moves to optics once a domain grows past one rack. Like OFC 2026 and OCP EMEA before this one, the industry keeps landing on the same answer: copper where you can so far, but optics remains the structural future direction.

The second theme was co-packaged optics, where views on the adoption timeline diverged. Nvidia and Broadcom both assert that they have CPO in production. ASE, one of the OSATs that assemble and test CPO packages, said the ecosystem is not ready.

On the non-optics side, our takeaway is that the industry is redesigning the entire power path end to end, from grid to chip. At the facility level, data center build-out is shifting from component stacking toward vertically integrated, modular designs that scale to GW-class deployments. In power architecture, the industry is converging on 800VDC as the next standard, with solid-state transformers emerging as the endgame for cutting conversion loss as rack power heads past the MW level. At the package level, power delivery is moving underneath the chip via vertical power delivery, reshaping component demand and driving higher-capacitance MLCC, smaller form-factor SPS, and a materials transition in inductors along the way.

We expand on these points below, then turn to our power takeaways, and close with the more technical optics sections.