--- 格式版本: 2 标题: "All News" 原文链接: "https://newsroom.intel.com/all-news" 发布日期: "2026-08-12" 发布时间校准状态: "found" 发布时间需复核: "否" 发布时间来源: "rule:local:strict_original_body" 发布时间证据: "Intel today announced the pricing of its previously announced registered public offering of common stock. The offering is expected to close on August 12, 2026, subject to customary closing conditions." 发布时间校准原因: "规则确认唯一严格发布时间，来源 local:strict_original_body" 发布时间校准置信度: "high" 发布时间候选数量: 10 发布时间严格候选数量: 1 发布时间原页读取状态: "source template page reused from URL open" 发布时间未找到原因: "" 发布时间校准时间: "2026-08-13T00:42:32+08:00" 发布时间仲裁状态: "skipped" 发布时间仲裁尝试次数: 0 发布时间仲裁耗时毫秒: 0 发现时间: "2026-08-13T00:40:24+08:00" 入库时间: "2026-08-12T16:42:32.975Z" 来源平台: "固定入口" 搜索渠道: "fixed_url" 搜索词: "https://newsroom.intel.com/" 匹配关键词: - "performance" - "bandwidth" - "AI" 相关厂家: - "Intel" 相关专家: [] 内容类型: "网页" 抓取工具: "Free Fetch + Defuddle" 清洗工具: "Defuddle Markdown + Defuddle/Readability 正文提取" 原始附件: [] AI优质: "否" AI打分: 5 AI分档: "非优质" AI质检状态: "不通过" AI打分理由: "固定新闻入口页，仅列出大量无关新闻标题，无任何超节点/AI Rack/机柜级AI基础设施相关技术或商业内容。" AI质检模型: "ali-deepseek-v4-flash" AI质检时间: "2026-08-13T00:43:05+08:00" AI主题相关性: 0 AI来源权威性: 5 AI新颖性: 0 AI技术细节: 0 AI商业部署信号: 0 AI完整性: 0 采集批次: "2026年8月12日20点58分23秒" 采集批次ID: "20260812-205823-234" 去重键: "https://newsroom.intel.com/all-news" --- 509 results [Corporate](https://newsroom.intel.com/corporate) ## [Intel Announces Upsize and Pricing of $20 Billion Common Stock Offering](https://newsroom.intel.com/corporate/intel-announces-upsize-and-pricing-of-20-billion-common-stock-offering) Intel today announced the pricing of its previously announced registered public offering of common stock. The offering is expected to close on August 12, 2026, subject to customary closing conditions. [Client Computing](https://newsroom.intel.com/client-computing) ![](https://newsroom.intel.com/wp-content/uploads/2026/08/26Q3-13-Intel-Gamer-Days-header.jpg) ## [Intel Gamer Days 2026 Kicking Off with AAA Gaming Bundle & Partnerships](https://newsroom.intel.com/client-computing/intel-gamer-days-2026-kicking-off-with-aaa-gaming-bundle-partnerships) Intel partnering with Fuse Games. & Crystal Dynamics on STAR WARS: Galactic Racer™ and Tomb Raider: Legacy of Atlantis for Intel platforms, including XeSS 3 support at launch [Corporate](https://newsroom.intel.com/corporate) ![Blue background with geometric shapes and the word intel in bold, white lowercase letters centered.](https://newsroom.intel.com/wp-content/uploads/2024/11/intel-card-scaled.jpg) ## [Intel Announces Proposed $15 Billion Common Stock Offering](https://newsroom.intel.com/corporate/intel-announces-proposed-15-billion-common-stock-offering) Proceeds intended to support general corporate purposes, including capital expenditures and working capital. [Corporate](https://newsroom.intel.com/corporate) ![a photo of Dean-Jarnac](https://newsroom.intel.com/wp-content/uploads/2026/08/Dean-Jarnac.jpg) ## [Intel Announces Leadership Appointment to Strengthen Customer Engagement and Accelerate Growth](https://newsroom.intel.com/corporate/intel-announces-leadership-appointment-to-strengthen-customer-engagement-and-accelerate-growth) [Corporate](https://newsroom.intel.com/corporate) ![](https://newsroom.intel.com/wp-content/uploads/2026/08/SEPP-Program-stock-image.jpg) ## [Creating Pathways to Semiconductor Careers: Intel Launches SEPP](https://newsroom.intel.com/corporate/creating-pathways-to-semiconductor-careers-intel-launches-sepp) Intel-funded initiative expands education-to-career pathways across key U.S. semiconductor regions [Intel Foundry](https://newsroom.intel.com/intel-foundry) ![](https://newsroom.intel.com/wp-content/uploads/2026/07/AdobeStock_1556239867.jpeg) ## [Intel’s U.S. Advanced Packaging Enables Next-Generation AI Semiconductors](https://newsroom.intel.com/intel-foundry/intels-us-advanced-packaging-enables-next-generation-ai-semiconductors) How Intel Foundry uses Foveros stacking, EMIB silicon bridges, and EMIB-T to scale chiplets, bypass the reticle limit, and power massive AI workloads. [Intel Foundry](https://newsroom.intel.com/intel-foundry) ![](https://newsroom.intel.com/wp-content/uploads/2025/01/intel-18a-wafer-3.jpg) ## [Intel Completes RAMP-C Program, Accelerating Momentum for Secure Enclave](https://newsroom.intel.com/intel-foundry/intel-completes-ramp-c-program-accelerating-momentum-for-secure-enclave) Program enabled validated prototypes, ecosystem readiness, and early customer engagement, creating a path to domestic leadership in high-volume manufacturing [Security](https://newsroom.intel.com/security) ![](https://newsroom.intel.com/wp-content/uploads/2026/07/rnb-with-american-flag-1.jpg) ## [Intel Secure Enclave: Securing High-Performance Computing at the Tactical Edge](https://newsroom.intel.com/opinion/intel-secure-enclave-securing-high-performance-computing-at-the-tactical-edge) Combining advanced process technology and secure manufacturing to strengthen mission performance and supply chain resilience [New Technologies](https://newsroom.intel.com/new-technologies) ![](https://newsroom.intel.com/wp-content/uploads/2026/07/newsroom-intel-glass-substrate-2.jpg) ## [Intel and Lens Technology Collaborate to Enable Advanced Semiconductor Packaging for the AI Era](https://newsroom.intel.com/new-technologies/intel-and-lens-technology-collaborate-to-enable-advanced-semiconductor-packaging-for-the-ai-era) Collaboration combines Intel's advanced packaging expertise with Lens Technology's precision glass processing capabilities to deliver enhanced performance for future AI and datacenter workloads [Corporate](https://newsroom.intel.com/corporate) ![Intel Logo](https://newsroom.intel.com/wp-content/themes/genesis-child-theme/images/intel-card-fallback.jpg) ## [Intel Reports Second-Quarter 2026 Financial Results](https://newsroom.intel.com/corporate/intel-reports-second-quarter-2026-financial-results) Intel’s second-quarter 2026 earnings news release and presentation are available on the company’s Investor Relations website. [Manufacturing](https://newsroom.intel.com/manufacturing) ![Fortinet and Intel logos on a blue background](https://newsroom.intel.com/wp-content/uploads/2026/07/Intel-Fortinet-final.png) ## [Intel and Fortinet Collaborate to Advance Cybersecurity Innovation and Strengthen Global Supply Chain Resilience](https://newsroom.intel.com/manufacturing/intel-and-fortinet-collaborate-to-advance-cybersecurity-innovation-and-strengthen-global-supply-chain-resilience) Fortinet’s purpose-built ASIC expertise and Intel’s semiconductor design, packaging, and manufacturing capabilities will drive greater security, scale, performance, and resiliency for organizations [Data Center](https://newsroom.intel.com/data-center) ![](https://newsroom.intel.com/wp-content/uploads/2026/07/Intel-Xeon-6-P-Cores-1.jpg) ## [Memory Bandwidth May Be the Most Overlooked AI Performance Metric](https://newsroom.intel.com/opinion/memory-bandwidth-may-be-most-overlooked-ai-performance-metric) Intel Xeon first to market with 8000 MT/s RDIMM support underscores why data movement is becoming a competitive differentiator.