---
格式版本: 2
标题: "CoolIT: Behind the World’s Most Advanced AI Coldplates"
原文链接: "https://www.coolitsystems.com/resources/news/coolit-behind-the-worlds-most-advanced-ai-coldplates/"
发布日期: "2026-07-28"
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发布时间校准时间: "2026-07-30T00:34:37+08:00"
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发现时间: "2026-07-30T00:34:18+08:00"
入库时间: "2026-07-29T16:34:37.602Z"
来源平台: "固定入口"
搜索渠道: "fixed_url"
搜索词: "https://www.coolitsystems.com/news"
匹配关键词:
  - "Liquid Cooling"
  - "HBM"
相关厂家:
  - "CoolIT Systems"
相关专家:
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内容类型: "网页"
抓取工具: "Free Fetch + Defuddle"
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AI优质: "是"
AI打分: 80
AI分档: "高置信优质"
AI质检状态: "通过"
AI打分理由: "正文来自专业液冷厂商，详细讨论AI服务器冷板设计、液冷系统级工程及250kW+机柜散热，技术细节丰富，来源权威，属高置信优质。"
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AI质检时间: "2026-07-30T01:36:48+08:00"
AI主题相关性: 18
AI来源权威性: 13
AI新颖性: 12
AI技术细节: 18
AI商业部署信号: 10
AI完整性: 9
采集批次: "2026年7月30日0点30分17秒"
采集批次ID: "20260730-003017-137"
去重键: "https://www.coolitsystems.com/resources/news/coolit-behind-the-worlds-most-advanced-ai-coldplates"
---

![Collection of CoolIT cold plates and liquid cooling components for high-density AI and HPC servers.](https://www.coolitsystems.com/wp-content/uploads/2026/07/coolit-cold-plates-and-liquid-cooling-components.jpeg)

Collection of CoolIT cold plates and liquid cooling components for high-density AI and HPC servers.

Next-generation AI silicon is driving power density and thermal complexity beyond conventional coldplate designs. Silicon developers need more than a component supplier – they need a direct liquid-cooling innovator who can co-design at the silicon, chip, server and rack levels.

For over 25 years, CoolIT has been that partner.

**Expertise to solve the toughest problems**

Coldplate design is a systems problem. Flow, pressure drop, thermal resistance, tolerance, manufacturability and reliability all come together. Every new AI platform recasts the tradeoffs. CoolIT’s engineers and technologists live inside that problem every day.

With deep knowledge of how direct liquid-cooling systems operate and a strong record of technical innovation, including more than 150 liquid cooling patents, CoolIT knows how to solve the toughest advanced computing thermal design challenges.

**A toolkit ready for speed**

AI system designers also need speed. CoolIT delivers a portfolio of pre-engineered, pre-validated building blocks, so advanced coldplate loops come together quickly without reinventing the foundation on every program.

Customers also leverage CoolIT’s advanced research into novel coldplate geometries, materials and manufacturing methods to address more complex thermal challenges.

The proof? Six generations of supercomputer cooled by CoolIT and the ongoing development of coldplate technologies for the industry’s highest-density AI server platforms, including a recently demonstrated 15kW single-phase coldplate.

**Cooling for Every Component = The whole server.**

A modern AI server is a landscape of heat sources and CoolIT engineers cooling for all components inside:

- Processors: CPUs, GPUs, ASICs and switch silicon
- Memory: DIMMs, HBM and SOCAMM
- Networking: OSFPs, QSFPs and NICs
- Storage: SSDs and E1.S drives
- Power: VRMs and PSUs

Component cooling is only part of the story. CoolIT engineers the whole server system, from individual coldplates to server-level loops and rack systems enabling up to 100% heat capture a foundation for ultra-high-density racks beyond 250kW.

**Unmatched capabilities**

CoolIT’s [**LiquidLab™**](https://www.coolitsystems.com/liquid-cooling-r-and-d/) innovation centers in Canada and Taiwan put concepts into action — combining prototyping, testing, validation, pilot manufacturing and UL certification under one roof.

Additionally, CoolIT’s high-volume coldplate loop manufacturing operations in China, Vietnam and Canada turn advanced designs into products at scale, globally delivered.

**Let’s design the next one together.**

The hardest thermal problems in AI silicon are already on our bench. **[Bring us yours](https://www.coolitsystems.com/contact/contact/).**