---
格式版本: 2
标题: "Engineering the Future of AI Infrastructure at OCP APAC 2026"
原文链接: "https://www.celestica.com/blog/article/engineering-the-future-of-ai-infrastructure-at-ocp-apac-2026"
发布日期: "2026-07-28"
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发现时间: "2026-07-29T19:31:30+08:00"
入库时间: "2026-07-29T11:31:50.304Z"
来源平台: "固定入口"
搜索渠道: "fixed_url"
搜索词: "https://www.celestica.com/blog/main"
匹配关键词:
  - "GPU"
  - "roadmap"
  - "deployment"
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相关厂家:
  - "Celestica"
  - "Meta"
相关专家:
  []
内容类型: "网页"
抓取工具: "Free Fetch + Defuddle"
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原始附件:
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AI优质: "否"
AI打分: 73
AI分档: "召回候选"
AI质检状态: "不通过"
AI打分理由: "Celestica官方会议预告，涉及AI基础设施、开放架构、800G/1.6T交换等，主题相关且来源权威，但技术细节不深入，缺少具体参数、量产或客户信号，新颖性一般，属于召回候选。"
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AI质检时间: "2026-07-30T01:45:44+08:00"
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AI新颖性: 12
AI技术细节: 12
AI商业部署信号: 8
AI完整性: 8
采集批次: "2026年7月29日18点11分54秒"
采集批次ID: "20260729-181154-692"
去重键: "https://www.celestica.com/blog/article/engineering-the-future-of-ai-infrastructure-at-ocp-apac-2026"
---

AI is reshaping the data center faster than many infrastructure strategies can keep up. Builders of AI environments are under pressure to bring capacity online quickly, scale without compromise, manage power and thermal complexity, reduce integration risk and avoid closed architectures. That is exactly why [Open Compute Project APAC 2026](https://www.opencompute.org/summit/2026-ocp-apac-summit) matters. This year’s theme, “Leading the Future of AI,” reflects the OCP Community’s focus on openness, efficiency, sustainability, scalability and growth as the industry works to shape the future of AI data centers through deeper collaboration.

From August 11th–12th in Taipei City, Celestica will be at the Taipei Nangang Exhibition Center, Hall 2 (TaiNEX 2). Visit us at booth PL03 to see how Celestica is engineering the future of AI infrastructure with open solutions.

Celestica has built a strong and growing presence within the OCP ecosystem, exhibiting at OCP conferences since fall 2022 and returning to OCP APAC after participating for the first time in 2025. As an OCP Platinum Member and active contributor to the OCP community, Celestica’s participation extends well beyond exhibiting to product and architecture leadership, including OCP-inspired and [OCP-accepted platforms](https://www.opencompute.org/contributions?contributions%5Bquery%5D=celestica) such as the DS5000, along with published AI reference architectures for [inference](https://www.opencompute.org/documents/open-cluster-designs-aligned-ai-inference-fabric-reference-architecture-pdf) and [training](https://www.opencompute.org/documents/ocp-open-cluster-designs-aligned-ai-training-fabric-ra-pdf) under the [Open Cluster Designs for AI initiative](https://www.opencompute.org/community/cluster-designs-for-ai).

Celestica’s continued engagement reflects our belief that the next era of AI infrastructure will be built on open collaboration, interoperable architectures and platforms designed to scale from silicon to system to rack to pod. It also aligns with the broader OCP vision for AI infrastructure, including the [AI Computing Continuum](https://www.opencompute.org/community/aicc), which aims to accelerate scalable, interoperable and sustainable AI systems. More recently, Celestica has helped shape community thinking around standardized AI cluster design through Open Cluster Designs for AI initiative focused on Open Pod Groups and Open Clusters, reinforcing our role in advancing open AI infrastructure, not just showcasing it.

For organizations building AI data centers, the challenge is no longer just acquiring high-performance components. The real challenge is bringing together networking, compute, storage, power, cooling, management and rack integration into a validated system that can be deployed with confidence and operated at scale. Celestica helps solve that challenge with hyperscale-inspired infrastructure backed by world-class design, engineering, manufacturing and an open ecosystem approach.

At OCP APAC, we will highlight our technology leadership across the AI infrastructure stack. Our portfolio includes advanced Ethernet switching for AI network fabrics, storage controllers and expansion platforms, rack management, and integrated rack-scale designs that support high-density power and cooling requirements. On the show floor, Celestica will feature the 51.2Tbps [DS5000](https://cls.celestica.com/hardware-platforms/ds5000/) switch while also showcasing the broader depth of our networking portfolio and OCP contributions.

Just as important, we will be speaking directly to the issues that keep infrastructure leaders up at night: how to scale 800G and 1.6T fabrics, how to accelerate deployment, how to maintain observability, and how to build open environments that reduce dependency on proprietary models.

## Live at OCP APAC 2026: See our Innovations in Action

Celestica will participate in a networking-track session, “Delivering a FBOSS Ready Platform - A Celestica Perspective,” featuring Purushotham Lala Balaji, Senior Director of Design Engineering at Celestica and Tao Ren, Software Engineer at Meta Platforms. The session will offer both hyperscaler and vendor perspectives on collaborative open platform development based on OCP designs, with Meta outlining how its Facebook Open Switching System (FBOSS) platform onboarding framework helps partners deliver production-ready hardware faster, and Celestica sharing how its teams operationalized that framework.

In the AI Clusters track, Arun Solleti, Technical Marketing Engineer at Celestica and Art Fewell Technical Marketing Engineer at Hedgehog, will present “High-Performance AI Fabrics Built on Open Standards: Scaling 800G and 1.6T Infrastructures.” Attendees will learn how open standards can be used to build production-ready AI fabrics for next-generation GPU clusters using Celestica’s DS5000 and [DS6000](https://cls.celestica.com/hardware-platforms/ds6000/) roadmap together with Hedgehog’s AI fabric software, and SONiC. They will also gain insight into the hardware-software co-design needed to manage 1.6T switching and high-density power profiles within the OCP framework.

Celestica will also be represented in SONiC booth demos by Arun Solleti and Bartek Raszczyk, Sales Engineer at Celestica, who will cover “AI-Assisted Network Fault Diagnosis for SONiC: An Open-Source Agentic Approach and Real-Time Observability & Analytics for SONiC AI & Enterprise Deployments.” Together, these sessions reflect the issues the market is actively working through today: how to build faster, manage smarter and scale AI infrastructure with greater openness and operational confidence. For more information on these sessions, visit the Speaker Events section of our [event landing page](https://cls.celestica.com/events/ocp-apac26/).

That same point of view has shaped Celestica’s recent event communications. In prior OCP-focused blogs such as [The 102.4T Milestone: Celestica DS6000 and the Dawn of 1.6T Networking](https://www.celestica.com/blog/article/the-102.4T-milestone-celestica-ds6000-and-the-dawn-of-1.6T-networking-join-us-at-the-ocp-emea-summit), Celestica emphasized both the performance demands of AI/ML environments and the importance of pairing advanced platforms with integration, validation and services that help customers deploy infrastructure that is ready to perform from day one.

More than 1,500 attendees joined OCP APAC in Taipei last year, including hyperscalers, cloud operators, enterprise IT leaders, telecom stakeholders and hardware ecosystem participants. For Celestica, the event is an ideal place to showcase technology and connect with the people solving the industry’s most complex AI infrastructure challenges.

If you are attending OCP APAC 2026, we invite you to visit Celestica at booth PL03 and meet with our experts on-site. Whether you are evaluating open networking for AI fabrics, planning high-density compute and storage deployments, or looking for a rack-scale partner that can help reduce time to deployment and integration complexity, we would welcome the opportunity to connect.

The future of AI infrastructure will not be defined by components alone. It will be defined by how effectively the industry brings together performance, openness, manufacturability and operational readiness. At Celestica, that is the future we are helping to engineer. We invite you to [continue the conversation](https://cls.celestica.com/events/ocp-apac26/) with us in Taipei.