--- 格式版本: 2 标题: "Cadence Automates PCB Design With AI Super Agents" 原文链接: "https://www.forbes.com/sites/karlfreund/2026/07/15/cadence-automates-pcb-design-with-ai-super-agents/" 发布日期: "2026-07-15" 发布时间校准状态: "found" 发布时间来源: "llm:strict_local_body" 发布时间证据: "Jul 15, 2026, 06:30pm EDT" 发布时间校准原因: "该日期位于标题下方作者/发布时间区域，是Forbes文章的标准发布时间格式，且与URL路径日期一致，确认为文章真实发布时间。" 发布时间校准置信度: "100" 发布时间候选数量: 17 发布时间严格候选数量: 2 发布时间原页读取状态: "原页面来自已抓取 HTML" 发布时间未找到原因: "候选日期无效或 LLM 未确认" 发布时间校准时间: "2026-07-17T18:08:32+08:00" 发现时间: "2026-07-17T15:03:56+08:00" 入库时间: "2026-07-17T10:12:11.343Z" 来源平台: "Tavily（AgentKey）" 搜索渠道: "tavily_web" 搜索词: "GPU" 匹配关键词: [] 相关厂家: - "NVIDIA" - "AMD" 相关专家: [] 内容类型: "网页" 抓取工具: "AgentKey Scrape" 清洗工具: "AgentKey Markdown + LLM 正文裁剪" 原始附件: [] 图片摘要: - "✓ ./assets/img-483c3a11.webp | infographic | AuraStack AI Super Agent平台功能概览，支持自然语言接口、多物理场优化，宣称提升2倍上市速度及15倍生产力。" - "✓ ./assets/img-49a22184.webp | infographic | Cadence完整的Agentic AI产品组合示意图，展示了针对电子设计的不同AI代理模块。" - "★ ./assets/img-87b28fbb.webp | diagram | AuraStack系统级优化架构图，展示其如何连接EDA设计与系统级验证，实现从简单生产力到系统优化的扩展。" - "✓ ./assets/img-92efa43f.jpg | photo | 文章作者Karl Freund的头像照片。" - "✗ ./assets/img-04420e59.jpg | other | 网页验证码干扰图，与正文无关" - "✗ ./assets/img-3469f0a4.jpg | other | 网页验证码干扰图，与正文无关" - "✓ ./assets/img-50597ebd.webp | infographic | Cadence AuraStack AI Super Agent平台特性图，展示自然语言接口、自主规划、多物理场优化及2倍上市速度、15倍生产力提升。" AI优质: "否" AI打分: 41 AI分档: "非优质" AI质检状态: "不通过" AI打分理由: "讨论的是Cadence的PCB设计自动化AI工具，非超节点/AI Rack等机柜级AI基础设施，主题相关性低。" AI质检模型: "deepseek-v4-flash" AI质检时间: "2026-07-30T01:04:19+08:00" AI主题相关性: 5 AI来源权威性: 8 AI新颖性: 10 AI技术细节: 5 AI商业部署信号: 5 AI完整性: 8 采集批次: "2026年7月17日15点03分52秒" 采集批次ID: "20260717-150352-345" 去重键: "https://www.forbes.com/sites/karlfreund/2026/07/15/cadence-automates-pcb-design-with-ai-super-agents" --- ## Cadence Automates PCB Design With AI Super Agents Contributor. Forbes contributors publish independent expert analyses and insights. Founder and Principal Analyst, Cambrian-AI Research LLC This voice experience is generated by AI. [Learn more](https://www.forbes.com/sites/forbesdigitalgroup/article/forbes-ai-audio-learn-more/). This voice experience is generated by AI. [Learn more](https://www.forbes.com/sites/forbesdigitalgroup/article/forbes-ai-audio-learn-more/). ## Summary Cadence has launched AuraStack, its latest "Super Agent" AI platform, designed to halve the time for Printed Circuit Board and advanced multi-chip packaging design. Accelerated by Nvidia, this AI-native environment promises to double time-to-market speed, boost productivity by 15X, and enhance quality through early multiphysics co-optimization, significantly reducing costly design iterations. AuraStack leverages "Mental Models"—knowledge graphs aggregating design intent—to enable autonomous planning and execution. This represents a major leap in EDA, allowing companies like Nvidia and AMD to achieve annual product cycles, fueling the AI semiconductor industry. The ChipStack AI Super Agent, part of this initiative, is now available. ![The AuraStack AI Super Agent automates the work to develop printed circuit boards (PCBs) and even advanced packaging needed for AI Accelerators.](./assets/img-50597ebd.webp) The AuraStack AI Super Agent automates the work to develop printed circuit boards (PCBs) and even advanced packaging needed for AI Accelerators. Cadence has been rolling out new “Super Agents” at an impressive pace to provide chip design teams with agentic AI support across the chip design workflow. The latest iteration will cut the time needed to design the Printed Circuit Boards (PCBs) and advanced multi-chip packaging in half, according to the company. Once again, Cadence named Nvidia as an early adopter. (Note that Cadence and Nvidia, like many players in the semiconductor industry, are both clients of my company, Cambrian-AI Research.) With this announcement, Cadence claims to offer autonomous AI coverage across the full chip design spectrum. Built on Cadence Allegro AI Studio and accelerated by Nvidia, AuraStack offers a unified, AI-native environment. It aims to accelerate time to market by 2X, boost productivity by 15X, and improve quality through early multiphysics co-optimization, significantly reducing costly design iterations and respins. ## What is a “Super Agent”? A [Cadence Super Agent](https://www.forbes.com/sites/karlfreund/2026/02/10/this-cadence-ai-super-agent-is-worlds-first-to-automate-chip-design/) is an agentic platform that helps translate a design team’s intent into working silicon using AI. Cadence has now rolled out four agentic AI suite that automate design and verification, analog chip design, digital chip implementation, and now PCB and Advanced Packaging design. PROMOTED ![The Agentic AI Super Agent portfolio.](./assets/img-49a22184.webp) The Agentic AI Super Agent portfolio. At the core of Cadence Super Agents are what the company calls “Mental Models”, knowledge graphs that aggregate existing design data, specifications, diagrams, libraries, and any other human-readable content that represents design intent. Mental Models serve as sources of ground truth on which agents can plan and direct their actions. These models then enable the stepwise planning, orchestration, and execution monitoring that engineers would have otherwise burdened the engineering team’s time. While chip design is indeed complex, the boards and packages onto which chips are mounted are also design challenges. PCBs can warp, crack, or even melt under the intense thermals that chips can produce. And the advanced packaging technologies such as TSMC CoWoS (Chip-on-Wafer-on-Substrate) are the largest current supply chain bottleneck that plagues the AI semiconductor industry. Consequently, the multi-physics aspect of AuraStack is critical to a successful project. ![The AuraStack ties together the entire process, from planning to multiPhysics to verification for PCB and Multi-chip advanced packaging.](./assets/img-87b28fbb.webp) The AuraStack ties together the entire process, from planning to multiPhysics to verification for PCB and Multi-chip advanced packaging. The Prompt: Get the week’s biggest AI news on the buzziest companies and boldest breakthroughs, in your inbox. You’re Subscribed! You’re Subscribed! ## The Bigger Picture Applying AI agents to speed the chip design process is perhaps the most significant advance the EDA world has seen in many years. Cadence, as are its primary competitors, Synopsys and Siemens, is quickly developing and deploying agentic AI to their customers to speed time to market, improve productivity, and increase system-level quality. This is one of the reasons major chip companies like Nvidia and AMD have been able to move from a historic two-to-three-year design cycle to an annual product cadence, adding fuel to the raging AI fire. The ChipStack AI Super Agent is available now for customer deployments. The Cadence ViraStack and InnoStack AI SuperAgents are in early engagements with development partners. Disclosures: This article expresses the opinions of the author and is not to be taken as advice to purchase from or invest in the companies mentioned. My firm, Cambrian-AI Research, is fortunate to have many semiconductor firms as our clients, including Baya Systems BrainChip, Cadence, Cerebras Systems, D-Matrix, Flex, Groq, IBM, Infleqtion, Intel, Micron, NVIDIA, Qualcomm, SImA.ai, Synopsys, Taalas, Tenstorrent, Ventana Microsystems, and scores of investors. I have no investment positions in any of the companies mentioned in this article. For more information, please visit our website at [https://cambrian-AI.com](https://cambrian-ai.com/ "https://cambrian-ai.com/"). ![The AuraStack AI Super Agent automates the work to develop printed circuit boards (PCBs) and even advanced packaging needed for AI Accelerators.](./assets/img-483c3a11.webp) ![The Agentic AI Super Agent portfolio.](./assets/img-49a22184.webp) ![The AuraStack ties together the entire process, from planning to multiPhysics to verification for PCB and Multi-chip advanced packaging.](./assets/img-87b28fbb.webp) ![Karl Freund](./assets/img-92efa43f.jpg)