--- 格式版本: 2 标题: "Recap of Wiwynn at COMPUTEX 2026: Scaling the AI Future" 原文链接: "https://www.wiwynn.com/news/recap-of-wiwynn-at-computex-2026-scaling-the-ai-future" 发布日期: "2026-06-26" 发布时间校准状态: "found" 发布时间需复核: "否" 发布时间来源: "rule:scrape:provider_published_at" 发布时间证据: "provider publishedAt: 2026-06-26" 发布时间校准原因: "规则确认唯一严格发布时间，来源 scrape:provider_published_at" 发布时间校准置信度: "high" 发布时间候选数量: 1 发布时间严格候选数量: 1 发布时间原页读取状态: "原页面已读取" 发布时间未找到原因: "" 发布时间校准时间: "2026-07-26T00:57:50+08:00" 发布时间仲裁状态: "skipped" 发布时间仲裁尝试次数: 0 发布时间仲裁耗时毫秒: 0 发现时间: "2026-07-26T00:57:34+08:00" 入库时间: "2026-07-25T16:57:50.968Z" 来源平台: "固定入口" 搜索渠道: "fixed_url" 搜索词: "https://www.wiwynn.com/news" 匹配关键词: - "CPO" - "Scale-up" - "Cold Plate" - "NVL72" - "Vera Rubin" - "performance" 相关厂家: - "Wiwynn" - "NVIDIA" - "AMD" 相关专家: [] 内容类型: "网页" 抓取工具: "Free Fetch + Defuddle" 清洗工具: "Defuddle Markdown + Defuddle/Readability 正文提取" 原始附件: [] AI优质: "是" AI打分: 90 AI分档: "高置信优质" AI质检状态: "通过" AI打分理由: "Wiwynn官方回顾COMPUTEX 2026，展示NVIDIA Vera Rubin NVL72、AMD Helios机架级方案、CPO光互连及先进散热技术，直接相关且有技术细节。" AI质检模型: "deepseek-v4-flash" AI质检时间: "2026-07-27T11:17:26+08:00" AI主题相关性: 20 AI来源权威性: 15 AI新颖性: 16 AI技术细节: 17 AI商业部署信号: 12 AI完整性: 10 采集批次: "2026年7月25日22点32分16秒" 采集批次ID: "20260725-223216-273" 去重键: "https://www.wiwynn.com/news/recap-of-wiwynn-at-computex-2026-scaling-the-ai-future" --- ![](https://www.youtube.com/watch?v=PNKlUzapu5U) At COMPUTEX 2026, Wiwynn showcased the evolution of next-generation AI infrastructure across compute, storage, interconnect, and cooling. The exhibition brought together practical, rack-scale innovations designed to support the growing performance and density demands of future AI data centers. Wiwynn showcased NVIDIA and AMD rack-scale platforms, including the NVIDIA Vera Rubin NVL72 and AMD Helios rack-scale solution, demonstrating its system integration capabilities for next-generation AI infrastructure. ![](https://www.youtube.com/watch?v=RlcTLJ9JQrs) In optical interconnect, Wiwynn collaborated with Ayar Labs, GUC, and fiber ecosystem partners—including Browave, Corning, FOCI, Molex, SENKO, and TE Connectivity—to demonstrate a CPO-based optical scale-up rack design. The showcase highlighted how optical connectivity can help overcome the limitations of traditional copper interconnects and support the next stage of AI scale-up. ![](https://www.youtube.com/watch?v=wU_oHQvZz0s) Complementing these innovations, Wiwynn introduced a range of advanced thermal designs, including the 6kW Double-sided Cold Plate with Liquid Metal TIM, Space Cooling concepts, and Diamond Composite Cooling technologies, reflecting our continued focus on solving system-level thermal challenges for high-density AI deployments. Wiwynn’s COMPUTEX 2026 showcase underscored our vision for the next generation of AI infrastructure—where compute, storage, interconnect, and cooling are designed together at rack scale. Through continued innovation and ecosystem collaboration, Wiwynn is advancing the system-level foundation for future AI data centers. ![20260602_014003594_iOS](https://www.wiwynn.com/hubfs/Events/Computex_2026/20260602_014003594_iOS.jpg) ![26-0603computex緯創-019](https://www.wiwynn.com/hs-fs/hubfs/Events/Computex_2026/26-0603computex%E7%B7%AF%E5%89%B5-019.jpg?width=5760&height=3843&name=26-0603computex%E7%B7%AF%E5%89%B5-019.jpg) ![26-0603computex緯創-022](https://www.wiwynn.com/hs-fs/hubfs/Events/Computex_2026/26-0603computex%E7%B7%AF%E5%89%B5-022.jpg?width=5760&height=3843&name=26-0603computex%E7%B7%AF%E5%89%B5-022.jpg) ![20260603_165649](https://www.wiwynn.com/hs-fs/hubfs/Events/Computex_2026/20260603_165649.jpg?width=12000&height=5148&name=20260603_165649.jpg) ![DSC03263_0](https://www.wiwynn.com/hubfs/Events/Computex_2026/DSC03263_0.jpg) ![20260603_165848-1](https://www.wiwynn.com/hs-fs/hubfs/Events/Computex_2026/20260603_165848-1.jpg?width=9069&height=5148&name=20260603_165848-1.jpg) ![20260602_070758548_iOS](https://www.wiwynn.com/hs-fs/hubfs/Events/Computex_2026/20260602_070758548_iOS.jpg?width=4431&height=3324&name=20260602_070758548_iOS.jpg) ![20260604_040834000_iOS 1](https://www.wiwynn.com/hs-fs/hubfs/Events/Computex_2026/20260604_040834000_iOS%201.jpg?width=3072&height=2046&name=20260604_040834000_iOS%201.jpg) [![Advanced_Microchannel_Material-Diamond_Composite_Thermal_Solutions](https://www.wiwynn.com/hubfs/Whitepapers/Advanced_Microchannel_Material-Diamond_Composite_Thermal_Solutions.jpg)](https://www.wiwynn.com/whitepapers/white-paper-advanced-microchannel-material-diamond-composite-thermal-solutions) [![Rack_Integration_and_Quality_Assurance_in_Modern_Data_Centers](https://www.wiwynn.com/hubfs/Whitepapers/Rack_Integration_and_Quality_Assurance_in_Modern_Data_Centers.jpg)](https://www.wiwynn.com/whitepapers/white-paper-rack-integration-and-quality-assurance-in-modern-data-centers)