---
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标题: "Liquid Data Center Cooling Solutions for HPC Clusters | Aspen Systems"
原文链接: "https://www.aspsys.com/solutions/infrastructure/liquid-cooling/"
发布日期: "2022-12-05"
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---

# HPC Liquid Cooling The Future of HPC is Liquid Cooled Here at the dawn of Exascale, HPC components are running hotter than ever before, increasing energy requirements across the board to keep up with the growing demand for greater performance and density. Today, liquid cooling technologies are more robust than ever before, providing incredible efficiency, serviceability, and temperature control at scales and price points that most data centers can’t afford to ignore anymore. You no longer need to build a completely new data center to experience the benefits of liquid cooling – new developments in cold plate and in-rack CDU technologies have made liquid cooling more accessible than ever before.

## The Benefits
### What are the Advantages of Liquid Cooling?
#### Greater Reliability & Performance
Air cooling simply can’t keep up with the growing density and heavy processing loads. With liquid cooling, you don’t need to throttle back CPU and GPU performance as much in order to prevent thermal runaway. Greater cooling power means greater performance from your HPC hardware.

#### Greater Efficiency
In addition to being 50-1,000 times more efficient at transferring heat than air, liquid cooling allows for far more precise temperature control with in-rack CDU and on-proc cold plate technologies. Instead of running coolant to the entire system all the time, you can run it directly to the racks that need it, reducing Opex.

#### Greater Density
With air-cooling, you limit the density of your data center. The increased cooling power of liquid cooling allows you to maximize the use of your data center space, achieving greater processing potential in smaller spaces, and avoiding the need for costly remodels or expansions.

#### Green Computing
Each year, data centers consume approximately two percent of global power consumption. Liquid cooling not only improves sustainability by helping data centers reduce energy consumption, but also allows them to repurpose captured heat more effectively.

Get a Quote
## Is Liquid Cooling Right for Your Data Center?
If the thought of having a liquid flow through your servers in a tube makes you cringe, you aren’t alone. If the cost to get a water-cooled system up and running for a cluster makes you squirm, again, you aren’t alone. However, as technology requires more power and cooling, we must accept the fact that liquid cooling is here to stay. With the increasing capacity of racks and thermal design power of modern processors leading to a greater need for efficient heat dissipation, you can no longer afford to ignore liquid cooling systems. These days, you don’t need to figure out what parts to get and from which manufacturer anymore, because manufacturers are creating kits for different systems. The engineers at Aspen Systems have worked with these manufacturers and can easily determine what you need for your solution. All of these advances are making it so that these solutions are becoming more affordable and more durable, leading to less failure and higher efficiency in your systems.

## In Partnership With
Aspen Systems proudly integrates liquid cooling technologies from the following providers into our world-class HPC solutions.

![hpc liquid cooling motivair](https://www.aspsys.com/wp-content/uploads/2022/12/hpc-liquid-cooling-motivair.jpg)
![supermicro liquid cooling](https://www.aspsys.com/wp-content/uploads/2022/12/supermicro-liquid-cooling-partner.jpg)
![hpc liquid cooling nvent](https://www.aspsys.com/wp-content/uploads/2022/12/hpc-liquid-cooling-nvent.jpg)
![hpc liquid cooling chilldyne](https://www.aspsys.com/wp-content/uploads/2022/12/hpc-liquid-cooling-chilldyne.jpg)
![hpc liquid cooling coolit systems](https://www.aspsys.com/wp-content/uploads/2022/12/hpc-liquid-cooling-coolit-systems.jpg)

## Motivair
### The Most Comprehensive End-To-End Liquid Cooling Platform
Motivair has a long history of cooling critical process facilities and production equipment. From its earliest days of industrial compressed air treatment to today’s cutting-edge cold plate and cooling system design and implementation, the Motivair brand is synonymous with process cooling.
* Coolant Distribution Unit
* Dynamic Cold Plates
* The ChilledDoor®
* Heat Dissipation Unit

#### Coolant Distribution Unit
![motivair coolant distribution unit](https://www.aspsys.com/wp-content/uploads/2022/12/motivair-coolant-distribution-unit.jpg)Coolant Distribution Units (CDUs) represent the widest range and highest capacity standard and custom OEM CDUs available. By decoupling a building cooling loop from liquid cooled computer systems or the ChilledDoor rack cooling system, critical IT equipment can be ensured to receive precise coolant temperatures and flow yielding optimal server performance and maximum uptime.
#### FEATURES
* Five (5) Standard Models
* Custom OEM Solutions
* Floor Mount & In-Rack profiles
* Capacities to 1.6 MW of IT load
* Built in redundancy and resiliency features
* Advanced PLC control and safety system
* Exascale Ready
* Made in USA

#### Dynamic Cold Plates
![motivair dynamic cold plate](https://www.aspsys.com/wp-content/uploads/2022/12/motivair-dynamic-cold-plate.jpg)Dynamic Cold Plates Motivair’s Dynamic Cold Plate harnesses innovative fluid dynamics to redefine direct liquid cooling. Our patent pending technology enables robust performance without the use of skived microchannels. The free-flowing nature of the Dynamic Cold Plate accelerates any system particles preventing them from depositing on the cold plate. It allows CPUs and GPUs to operate at peak performance while reducing the reducing the possibility of cooling degradation and costly system failures. This simple yet effective technology is optimized for cost efficient and scalable production, targeted specifically for High Performance Computing, small to larger clusters and Exascale class systems. All products are engineered and manufactured in the USA, ensuring a predictable, end to end experience while eliminating the risks of foreign supply chain disruptions.
#### FEATURES
* Uniform cooling across entire package
* Resistance to fluid fowling
* Unique enhanced cold plate design
* Low profile
* Pushlok connections
* Variable connection locations
* OEM Customization
* Made in USA

#### The ChilledDoor®
Active rear door heat exchanger that is mounted directly to the back of any standard server rack. Designed for and used by the world’s preeminent enterprise data center and super computer owners and operators, the ChilledDoor® allows for on-demand cooling on a per rack, row or room level ensuring optimal computer performance and maximum uptime.
#### FEATURES
* 0-75kW cooling capacity with 100% Heat Removal
* Designed to fit any industry standard server rack
* Open19 and OCP compliant
* Made in the USA
* High powered adjustable PLC control system for active cooling of server racks

#### Heat Dissipation Unit
![motivair heat distribution unit](https://www.aspsys.com/wp-content/uploads/2022/12/motivair-heat-distribution-unit.jpg)Heat Dissipation Unit In the absence of available building cooling water, the heat from the computer cooling system must be rejected to air, a process that can now be facilitated by Motivair’s Heat Dissipation Unit (HDU). The Motivair HDU is connected directly to the computer cooling loop and sits adjacent to or proximate to the computer racks. Circulation pumps located inside the HDU move hot water from the computer system to the HDU’s air-cooled heat exchanger. High-efficiency EC fans draw cool room air across the HDU’s internal heat exchanger, removing heat from the computer cooling system. A high-powered PLC controls and monitors all aspects of HDU performance ensuring the HPC system can operate within thermal specifications and without dependence on a building water supply.
#### FEATURES
* Location of liquid cooled system prevents water from being plumbed to the computers
* Current cooling solution does not have enough capacity to absorb heat from the liquid cooled computer system
* Chilled or cool water is not available at the site
* Beta testing of liquid cooled computer systems prior to full scale deployment
* Made in the USA

## SuperMicro
### Efficient Cooling for Maximum Density and Sustainability
Supermicro delivers cutting-edge liquid cooling solutions designed for the most demanding HPC and AI workloads. Their direct-to-chip (D2C) cooling technologies and rack-scale liquid cooling infrastructure enable optimal thermal performance, energy efficiency, and density for GPU-accelerated and CPU-intensive deployments. With a focus on sustainability and high availability, Supermicro’s solutions help organizations reduce data center power consumption while maximizing computational throughput.
* Direct Liquid Cooling
* In-Rack CDUs
* Immersion Cooling
* Read Door Heat Exchanger

#### Direct Liquid Cooling
![supermicro direct to chip](https://www.aspsys.com/wp-content/uploads/2022/12/supermicro-direct-to-chip.png)Direct-To-Chip Liquid Cooling Direct-to-Chip cooling uses cold plates mounted directly on high-heat components like CPUs and GPUs to efficiently draw heat away using circulating liquid. This closed-loop system transports heat-laden coolant to a cooling unit—either within the rack or externally—before returning chilled liquid back to the chip. The result is significantly improved thermal performance, reduced fan load, and increased rack density for high-performance compute environments.
#### FEATURES
* Cold plates transfer heat directly from chips to circulating coolant
* Closed-loop liquid flow enables high-efficiency heat removal
* In-rack or external Coolant Distribution Units (CDUs) manage thermal loads
* Supports densities up to 80 kW per rack
* Frees up airflow and lowers noise vs. traditional air cooling
* Compatible with modern CPUs, GPUs, and memory configurations

#### In-Rack CDUs
![supermicro direct to chip in row cdu](https://www.aspsys.com/wp-content/uploads/2022/12/supermicro-direct-to-chip-in-row-cdu.png)Direct-to-Chip Cooling with In-Rack CDU Supermicro’s Direct-to-Chip (D2C) liquid cooling solution efficiently removes heat directly from CPUs and GPUs using cold plates. The heated liquid is circulated through a closed-loop system and cooled by an in-rack Coolant Distribution Unit (CDU), which is strategically placed to reduce tube length and minimize footprint. This design supports high thermal loads while reducing fan power and lowering total energy consumption—ideal for modern HPC and AI workloads.
#### FEATURES
* Cold plates installed directly on CPUs, GPUs, and memory modules
* In-rack CDUs can remove up to 80 kW of heat per rack
* CDUs can be placed at various rack heights to optimize cooling layout
* Closed-loop liquid cooling cycle with reduced fan and CRAC requirements
* Supports dense, high-performance compute nodes with minimal jitter
* Optional external cooling systems for even higher capacity scalability
* Ideal for installations requiring 40–80+ kW per rack of cooling

#### Immersion Cooling
![supermicro immersion cooling](https://www.aspsys.com/wp-content/uploads/2022/12/supermicro-immersion-cooling.png)Immersion Cooling Immersion cooling submerges entire servers in a non-conductive, non-corrosive liquid that directly absorbs heat from all components. As the fluid warms, it rises naturally and is removed from the tank to be cooled in an external system before circulating back. This method is ideal for high-density or edge deployments where traditional data center infrastructure is unavailable or impractical.
#### FEATURES
* Fully submerges servers in dielectric coolant for direct heat transfer
* Requires no server fans or chassis airflow
* Uses external chillers to recool fluid in a closed-loop system
* Reduces noise, power consumption, and mechanical failure points
* Ideal for confined, remote, or mobile environments
* Supports high-performance, high-density computing workloads

#### Read Door Heat Exchanger
![supermicro rear door heat exchanger](https://www.aspsys.com/wp-content/uploads/2022/12/supermicro-rear-door-heat-exchanger.png)Rear Door Heat Exchanger (RDHx) Rear Door Heat Exchangers offer a non-invasive cooling option for data centers that can’t support direct-to-chip or immersion solutions. These systems mount on the back of server racks, capturing and cooling hot exhaust air before it re-enters the data center. Integrated fans and liquid-cooled coils absorb the heat, significantly reducing reliance on traditional CRAC systems.
#### FEATURES
* Mounts directly to the rear of server racks for inline cooling
* Uses liquid-cooled coils and fans to absorb and dissipate heat
* Reduces ambient temperature and CRAC system load
* Ideal for retrofitting existing data centers without infrastructure upgrades
* Supports high-density deployments without affecting server layout
* Closed-loop cooling cycle with external chiller integration

## Nvent
### High Availability At Minimal Operating Costs
High availability at minimal operational costs remains the major challenge in data centers and networks. Preventing servers from overheating accounts for a large portion of data center budgets. Besides the traditional HPC for calculations and simulations, AI-related compute-intensive applications have also increased the development of new designs for efficient cooling for data centers and edge computing.
* Direct Liquid Cooling
* RackChiller Rear Door
* RackChiller In Row
* RackChiller In Rack

#### Direct Liquid Cooling
![nvent direct liquid cooling](https://www.aspsys.com/wp-content/uploads/2022/12/nvent-direct-liquid-cooling.jpg)Direct-To-Chip Liquid Cooling nVent and CoolIT have joined forces to create an enclosure for very high density computing environments. An nVent Schroff RackChiller Rear Door Cooler is combined with a CoolIT Direct Contact Liquid Cooling Distribution Unit to achieve new levels of rack-level cooling efficiency.
#### FEATURES
* Designed to remove 100% of the heat generated in very high density IT racks
* Combines the extreme heat removal of Direct Contact Liquid Cooling at the chip level with a Rear Door air-to-water heat exchanger for residual heat removal
* Uses a single facility water line
* Sophisticated, coordinated controls
* Warm water exiting the RackChiller Rear Door Cooler complements the input requirements of the CoolIT CHx80 Cooling Distribution Unit (CDU)
* High temperature return water increases efficiency and can be used for heat re-use

#### RackChiller Rear Door
![nvent rackchiller rear door](https://www.aspsys.com/wp-content/uploads/2022/12/nvent-rackchiller-rear-door.jpg)RackChiller Rear Door RackChiller Rear Door Cooler (RDC) Heat Exchanger is designed for managing high heat load cooling requirements within high-density server, computing and storage racks. The RDC installs on equipment racks as a separate rear door with an extra frame, enabling it to be retrofitted to existing racks. Heat dissipated by the rack equipment will be removed by the air-to-liquid heat exchanger and transfered into the facility water circuit, adding no heat to the IT room. Door-mounted fans support the IT equipment air flow to overcome the coil impedance. The integrated controller modulates the water flow to keep a constant supply air temperature, as well as the fan speed to maintaining a (configurable) pressure differential between rack and IT room. The entire system is integrated within an aesthetically framed perforated door with protective covers to isolate the liquid source and cooling loop from the rack-mounted equipment.
#### FEATURES
* Passive solution – no noise, no additional power consumption, low maintenance efforts
* Active solution – fans support the air flow and minimize pressure drop of the heat exchanger supporting heterogeneous rack-mount equipment
* Frame solution allows separation of coil and condensate management from the rack-mount equipment and rear space inside the cabinet is completely available for cabling and power distribution
* Available in 6 different standard dimensions

#### RackChiller In Row
![nvent rackchiller in row](https://www.aspsys.com/wp-content/uploads/2022/12/nvent-rackchiller-in-row.jpg)RackChiller In Row nVent SCHROFF RackChiller In Row Chilled Water Heat Exchanger is designed to manage the critical cooling requirements of server and network racks. The entire system is housed in a separate enclosure and is integrated into a row of contained server racks. Active fans move the warm exhaust air from the servers through an air-to-water heat exchanger and the heat is transferred to a water circuit. The fans provide the chilled air to the equipment. The units can be scaled optimally to suit packaging density and redundancy can be implemented.
#### FEATURES
* The units can be scaled optimally to suit packaging density and redundancy can be implemented.
* Available in 2 different performance classes – Cooling performance of 55kW (300 mm) and 75kW (600 mm) in optimal operating conditions
* Built-in redundancy through EC fan techn…