--- 格式版本: 2 标题: "Celestica Accelerates AI-Scale Networking: DS6000-Series 1.6TbE Switches Now Available to Order | Celestica Inc." 原文链接: "https://corporate.celestica.com/news-releases/news-release-details/celestica-accelerates-ai-scale-networking-ds6000-series-16tbe" 发布日期: "2026-04-29" 发布时间校准状态: "found" 发布时间需复核: "否" 发布时间来源: "manual" 发布时间证据: "正文开头明确标注新闻稿发布日期为2026年4月29日，且出现'today announced'，符合文章发布时间。" 发布时间校准原因: "正文开头明确标注新闻稿发布日期为2026年4月29日，且出现'today announced'，符合文章发布时间。" 发布时间校准置信度: "manual-confirmed" 发布时间候选数量: 0 发布时间严格候选数量: 0 发布时间原页读取状态: "manual" 发布时间未找到原因: "" 发布时间校准时间: "2026-08-17T07:34:21+08:00" 发布时间仲裁状态: "manual" 发布时间仲裁尝试次数: 0 发布时间仲裁耗时毫秒: 0 发现时间: "2026-08-16T23:54:36+08:00" 入库时间: "2026-08-16T15:59:56.101Z" 来源平台: "固定入口" 搜索渠道: "fixed_url" 搜索词: "https://www.celestica.com/news/media-information" 匹配关键词: - "AI" - "Scale-up" - "deployment" - "performance" - "bandwidth" - "throughput" 相关厂家: - "Celestica" - "Broadcom" 相关专家: [] 内容类型: "网页" 抓取工具: "Jina Reader" 清洗工具: "Jina Reader Markdown + Defuddle/Readability 正文提取" 原始附件: [] AI优质: "是" AI打分: 93 AI分档: "高置信优质" AI质检状态: "通过" AI打分理由: "Celestica官方宣布DS6000系列1.6TbE交换机可订购，采用Broadcom Tomahawk 6，提供64端口1.6TbE、102.4Tbps，支持风冷/液冷、铜缆/光互连，面向AI工厂背端网络，符合OCP/UEC标准，技术…" AI质检模型: "ali-deepseek-v4-flash" AI质检时间: "2026-08-17T00:00:03+08:00" AI主题相关性: 18 AI来源权威性: 15 AI新颖性: 18 AI技术细节: 18 AI商业部署信号: 14 AI完整性: 10 采集批次: "2026年8月16日20点37分10秒" 采集批次ID: "20260816-203710-016" 去重键: "https://corporate.celestica.com/news-releases/news-release-details/celestica-accelerates-ai-scale-networking-ds6000-series-16tbe" --- Title: Celestica Accelerates AI-Scale Networking: DS6000-Series 1.6TbE Switches Now Available to Order | Celestica Inc. URL Source: https://corporate.celestica.com/news-releases/news-release-details/celestica-accelerates-ai-scale-networking-ds6000-series-16tbe Published Time: Sat, 15 Aug 2026 09:17:49 GMT Markdown Content: [Skip to main navigation](https://corporate.celestica.com/news-releases/news-release-details/celestica-accelerates-ai-scale-networking-ds6000-series-16tbe#main-menu) **[![Image 1: Celestica](https://corporate.celestica.com/sites/g/files/knoqqb106071/themes/site/client_site/local/images/main-logo.svg)](https://www.celestica.com/)** * [About Us](https://corporate.celestica.com/news-releases/news-release-details/celestica-accelerates-ai-scale-networking-ds6000-series-16tbe) About Us * [Who We Are](https://www.celestica.com/about-us/who-we-are) * [Locations](https://www.celestica.com/about-us/locations) * [Executive Team](https://www.celestica.com/about-us/leadership-team/executive-team) * [Company Directors](https://www.celestica.com/about-us/leadership-team/company-directors) * 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DS6000-Series 1.6TbE Switches Now Available to Order Apr 29, 26 at 7:45 AM EDT [PDF Version](https://corporate.celestica.com/node/17411/pdf) TORONTO, April 29, 2026 (GLOBE NEWSWIRE) -- [Celestica Inc](http://celestica.com/). (NYSE: CLS) (TSX: CLS), a global leader in data center infrastructure and advanced technology solutions, today announced its DS6000-series 1.6TbE switches are available for order to initial customers. This milestone signals the platform’s transition from development to ready-to-order status, providing the critical backbone for the next generation of generative AI and machine learning infrastructure. The DS6000-series is available in two versatile form factors to match specific cooling infrastructures: the air-cooled 3RU [DS6000](https://cls.celestica.com/hardware-platforms/ds6000/) for standard 19-inch racks, and the hybrid-cooled 2OU [DS6001](https://cls.celestica.com/hardware-platforms/ds6001/) for 21-inch OCP ORv3 environments. Powered by the Broadcom Tomahawk 6 (TH6) switch silicon, the platforms deliver up to 102.4 Tbps of non-blocking switching capacity. Designed to eliminate bottlenecks in massive AI training clusters, the series features 64 ports of 1.6TbE (OSFP224) connectivity, offering the highest bandwidth density silicon solution available on the market today. The high-density 1.6TbE infrastructure is specifically engineered for the critical AI back-end networks of modern ‘AI factories,’ facilitating seamless scale-up and scale-out networking by leveraging industry standards, including Ultra Ethernet Consortium (UEC) and Open Compute Project (OCP) Ethernet Scale-up Network (ESUN) specifications. To ensure maximum architectural flexibility, the DS6000-series supports both high-speed copper interconnects and advanced 1.6TbE optical interconnects. "The move to 1.6TbE networking represents a monumental leap in data center evolution, and our engineering teams have worked tirelessly to ensure the DS6000-series is the definitive choice for the AI era," said Gavin Cato, SVP & GM, AI Platform Engineering, Celestica. "By integrating enterprise-class reliability with the flexibility of open networking through SONiC, we have engineered a solution that not only meets current throughput demands but helps future-proof the AI fabric for our global customers." “As the industry transitions to 102.4T switching to meet the growing bandwidth demands of generative AI, the collaboration between Broadcom and Celestica is more important than ever,” said Hasan Siraj, Vice President of Product Management, Core Switching Group, Broadcom. “By being among the first to ship systems powered by our Tomahawk 6 silicon, Celestica is delivering a high-density 1.6TbE networking fabric essential for scaling next-generation AI clusters. The Celestica DS6000 series demonstrates how our combined expertise can reduce performance bottlenecks and accelerate the deployment of high-performance AI infrastructure.” "As the industry races toward 100T-plus switching capacity to support the explosion of generative AI, Celestica has established a leading position in high-speed data center switch port shipments," said Sameh Boujelbene, Vice President at Dell’Oro Group. "Their ability to deliver high-density 800G and 1.6TbE solutions based on open standards reflects a deep understanding of the infrastructure demands required to scale the next generation of AI and high-performance computing markets." "We are pleased to see the Celestica DS6000 series become more available to our customers as the demand for 1.6T bandwidth continues to increase," said Dennis Levenson, Vice President, Vendor Management – GCC (Global Computing & Components) at TD SYNNEX. "As AI and machine learning workloads scale exponentially, our partners need high-density, open-standard solutions that can eliminate complex networking bottlenecks. The arrival of the DS6000 series, backed by Celestica’s engineering leadership and the flexibility of SONiC, provides the high-performance backbone our customers require to drive data center innovation." The DS6000-series is now available for order. This enables customers to secure high-density 1.6TbE infrastructure essential for scaling their next-generation AI and machine learning clusters. Celestica will showcase the DS6001 and lead technical discussions on 1.6TbE bandwidth at the upcoming OCP Regional Summit in Barcelona, Spain, from April 29-30. Visit our [event landing page](https://cls.celestica.com/events/ocp-emea26/) to learn more. **About Celestica** Celestica is a technology leader dedicated to driving customer success and market advancements. With deep expertise in design, engineering, manufacturing, supply chain, and platform solutions, Celestica enables critical data center infrastructure for AI, cloud, and hybrid cloud and advances technologies in high-growth markets. With a talented team and a strategic global network, Celestica helps its customers achieve competitive advantages. 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