--- 格式版本: 2 标题: "Advanced Thermal & Mechanical" 原文链接: "https://www.wiwynn.com/technology/advanced-thermal-and-mechanical" 发布日期: "2026-03-10" 发布时间校准状态: "found" 发布时间需复核: "否" 发布时间来源: "manual" 发布时间证据: "候选日期来自页面元数据的发布字段，且两个候选一致，符合发布时间判定。" 发布时间校准原因: "候选日期来自页面元数据的发布字段，且两个候选一致，符合发布时间判定。" 发布时间校准置信度: "manual-confirmed" 发布时间候选数量: 0 发布时间严格候选数量: 0 发布时间原页读取状态: "manual" 发布时间未找到原因: "" 发布时间校准时间: "2026-08-15T10:28:37+08:00" 发布时间仲裁状态: "manual" 发布时间仲裁尝试次数: 0 发布时间仲裁耗时毫秒: 0 发现时间: "2026-08-14T21:23:21+08:00" 入库时间: "2026-08-14T13:24:13.457Z" 来源平台: "固定入口" 搜索渠道: "fixed_url" 搜索词: "https://www.wiwynn.com/news" 匹配关键词: - "Liquid Cooling" - "Cold Plate" - "delivery" - "deployment" - "performance" - "latency" - "throughput" - "AI" 相关厂家: - "Wiwynn" 相关专家: [] 内容类型: "网页" 抓取工具: "Free Fetch + Defuddle" 清洗工具: "Defuddle Markdown + Defuddle/Readability 正文提取" 原始附件: [] AI优质: "是" AI打分: 81 AI分档: "高置信优质" AI质检状态: "通过" AI打分理由: "Wiwynn官网技术页面，详细介绍了AI服务器机柜级液冷、双面冷板、双宽机架平台等，技术细节具体，来源权威，主题高度相关，具备部署信号，内容完整。" AI质检模型: "ali-deepseek-v4-flash" AI质检时间: "2026-08-14T21:24:48+08:00" AI主题相关性: 18 AI来源权威性: 13 AI新颖性: 15 AI技术细节: 16 AI商业部署信号: 10 AI完整性: 9 采集批次: "2026年8月14日18点30分41秒" 采集批次ID: "20260814-183041-680" 去重键: "https://www.wiwynn.com/technology/advanced-thermal-and-mechanical" --- #### Engineering Beyond Thermal Limits: Integrated System Architecture ![](https://www.youtube.com/watch?v=L3q-FffEE2g) #### Next-Gen Liquid Cooling & Intelligent Management - **Scalable Integrated Architecture： **Precision-engineered cold-plate cooling optimized for ultra-high TDP AI accelerators. Designed for maximum compute density while ensuring seamless field-serviceability and modular scalability. - **Mission-Critical Proactive Safety： **Multi-layer leak detection with millisecond-latency telemetry. Real-time rack-level alerting mitigates operational risk, ensuring continuous uptime and SLA-grade reliability. - **UMS： **Intelligent Infrastructure Orchestration Centralized monitoring of flow, thermal gradients, and pressure dynamics via standardized, DCIM-ready interfaces for peak operational transparency and efficiency. ![先進散熱-7](https://www.wiwynn.com/hs-fs/hubfs/Revamp/%E5%85%88%E9%80%B2%E6%95%A3%E7%86%B1-7.png?width=2100&height=978&name=%E5%85%88%E9%80%B2%E6%95%A3%E7%86%B1-7.png) #### Dual-Sided Cold Plate & Microchannel Innovation Wiwynn’s **Double-Sided Cold Plate** technology redefines thermal management for high-power-density silicon. By simultaneously cooling high-power AI chips on the top side and vertical power delivery components on the bottom side, it supports total thermal loads exceeding 4 kW within a compact form factor. We continue to adopt advanced manufacturing approaches to enable the design and fabrication of high-precision microchannel structures tailored to actual chip heat distribution. Compared to conventional architectures, this approach significantly enhances thermal performance, supports heat fluxes beyond 350 W/cm², and delivers an optimal balance between silicon performance and long-term system reliability. #### In‑house double‑wide Rack platform - **Ruggedized Hyperscale Foundation： **A reinforced, anti-sagging chassis engineered for the mechanical stresses of mass global deployment. This architecture supports high-TDP AI clusters while integrating HVDC power paths and advanced signal integrity to eliminate bottlenecks. - **Tailored for the AI Ecosystem：** Fully aligned with **OCP (Open Compute Project)** ORW and Double-Wide standards to streamline brownfield and greenfield integration. Purpose-built for high-intensity AI training and inference at scale. - **Deployment-Ready Flexibility：** From factory-to-datacenter, our co-design and specialized packaging ensure system integrity during transit. Scalable by design, this platform evolves alongside your evolving workload demands. ![2026-Wiwynn-網頁_pic_W_EN (1)](https://www.wiwynn.com/hs-fs/hubfs/Revamp/2026-Wiwynn-%E7%B6%B2%E9%A0%81_pic_W_EN%20(1).png?width=2100&height=1167&name=2026-Wiwynn-%E7%B6%B2%E9%A0%81_pic_W_EN%20(1).png) ![2026-Wiwynn-網頁_pic_Double‐wide rack platform_EN](https://www.wiwynn.com/hs-fs/hubfs/Revamp/2026-Wiwynn-%E7%B6%B2%E9%A0%81_pic_Double%E2%80%90wide%20rack%20platform_EN.png?width=2400&height=1506&name=2026-Wiwynn-%E7%B6%B2%E9%A0%81_pic_Double%E2%80%90wide%20rack%20platform_EN.png) #### Air-Assisted Liquid Cooling Solution Wiwynn’s **AALC solutions** provide a bridge to liquid cooling without requiring immediate facility-level infrastructure overhauls. We enable rapid, rack-level AI deployment into existing air-cooled environments, maintaining peak compute performance while balancing TCO and performance-per-watt. ![先進散熱-5](https://www.wiwynn.com/hs-fs/hubfs/Revamp/%E5%85%88%E9%80%B2%E6%95%A3%E7%86%B1-5.png?width=1500&height=1086&name=%E5%85%88%E9%80%B2%E6%95%A3%E7%86%B1-5.png) **As a key OCP player, we’ve published white papers on cooling and management at OCP and our global site. Download the technical details here:** [![2026-Wiwynn-網頁_pic-13](https://www.wiwynn.com/hs-fs/hubfs/Revamp/2026-Wiwynn-%E7%B6%B2%E9%A0%81_pic-13.png?width=4752&height=3774&name=2026-Wiwynn-%E7%B6%B2%E9%A0%81_pic-13.png)](https://www.wiwynn.com/whitepapers) ###### 1 min read #### [White Paper: CAE-Assisted Cable Routing Methodology for High-Density Server Platforms](https://www.wiwynn.com/whitepapers/cae-assisted-cable-routing-methodology-for-high-density-server-platforms) As AI server systems continue to scale rapidly in power and data throughput, cable density within server platforms has... ###### 1 min read #### [White Paper: A Guideline for Direct Liquid Cooling Testing Platform](https://www.wiwynn.com/whitepapers/a-guideline-for-direct-liquid-cooling-testing-platform) As server power density continues to increase in modern AI and high-performance computing applications, direct liquid... #### [White Paper: Introduction to SPDM Attestation between BMC and EROT on AI server](https://www.wiwynn.com/whitepapers/introduction-to-spdm-attestation-between-bmc-and-erot-on-ai-server) This whitepaper introduces SPDM attestation between a BMC and an External Root of Trust (EROT) on AI servers. It... #### [White Paper: Firmware Design for Hardware Partitioning](https://www.wiwynn.com/whitepapers/firmware-design-for-hardware-partitioning) Hardware partitioning divides a single server into physically isolated subsystems with independent CPU, memory, and I/O... ## Exploring infinite possibilities Collaborating with global leaders to drive OCP standards and define the future of the cloud.